The Temperature and Humidity Data Logger is one of the temperature and humidity meters in the temperature and humidity measuring instrument. It has a built-in temperature and humidity sensor or can be connected to external measurement of temperature and humidity.
harm
integrated circuit
The harm of moisture to the semiconductor industry is mainly manifested in the fact that moisture can penetrate into the IC through the gap of pins and the like through the IC plastic package, resulting in IC moisture absorption. Water vapor is formed in the heating process of the SMT process, and the generated pressure causes cracking of the IC resin package and oxidation of the metal inside the IC device, resulting in product failure. In addition, when the device is soldered during the PCB board, the solder joint pressure will also cause the solder joint. According to the IPC-M190 J-STD-033 standard, SMD components exposed to high-humidity air must be placed in a drying oven below 10% RH humidity for 10 times of the exposure time to restore the component's "workshop." "Life", avoid scrapping and ensure safety.
Liquid crystal device
Although the glass substrate and the polarizer and the filter lens of the liquid crystal display such as the liquid crystal display are to be cleaned and dried in the production process, they are still affected by the moisture after the temperature is lowered, and the yield of the product is lowered. Therefore, after cleaning and drying, it should be stored in a dry environment below 40% RH.
Other electronic components such as capacitors, ceramic devices, connectors, switch parts, solder, PCB, crystal, silicon wafer, quartz oscillator, SMT adhesive, electrode material adhesive, electronic paste, high-brightness device, etc., will be wet. harm.
The semi-finished product in the electronic device package during the operation to the next process; between the PCB package and after the package to the power supply; the IC, BGA, PCB, etc. after the unpacking but not used; the device waiting for the soldering of the tin furnace; The components that are to be warmed up after baking; the finished products that have not been packaged, etc., will be exposed to moisture.
The finished electronic machine will also be exposed to moisture during storage. If the storage time is too long in a high-humidity environment, it will cause a malfunction, and the CPU of the computer board will oxidize the gold finger and cause a malfunction.
The production environment of electronic industry products and the storage environment of products should be below 40%. Some varieties also require lower humidity.
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