Temperature when the semi-automatic edge banding machine is edge-sealing


Since the performance of the edge-sealing hot-melt adhesive is affected by temperature, temperature is a very important indicator during the edge-sealing process. The hot melt temperature, substrate temperature, edge material temperature and working environment (the workshop where the semi-automatic edge banding machine is located) are very important edge sealing parameters. On the semi-automatic edge banding machine, because the glue is applied to the substrate, the substrate with too low temperature will preheat the hot melt adhesive, which will cause the glue to stick to the substrate, but it will not adhere to the edge sealing material, the temperature of the substrate. It is best to keep above 20 °C. The working environment temperature of the semi-automatic edge banding machine will affect the curing speed of the glue. Factories often have edge sealing problems in low temperature seasons. The reason is that the curing speed of hot melt adhesives is accelerated at low temperatures, and the effective bonding time is shortened. If the feed speed of the semi-automatic edge banding machine cannot be changed (in most cases), the sheet and edge seal material must be preheated to ensure the quality of the edge seal.

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